Sub micron defect sensitivity
First system in the world to do wafer 3D & 2D analysis simultaneously
- Increase your yield with the most advanced A.I. in semiconductor metrology.
- BTBP's system detects and quantifies process defects.
- Wafer metrology is the key to process control and yield enhancement.
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- Load & scan the wafer.
- Capture the full wafer for 2D and 3D analysis.
- Recipe setup and binning capability.
- Classify wafer defects and generate highest resolution 3D models for quantitative measurements.
- Detect & display defects like particles, scratches, missing patterns & bumps.
Highlights
![](images/defectDetect.webp)
DETECTING THE DEFECTS
Bumps on the wafer:
- Identifying X, Y location(relative to notch), minimum height, maximum height, average height and diameter of the bump on a wafer.
- Information is saved in the industry standard KLARF format.
![](images/defectDetect2.webp)
![](images/icons/Binning Graphic.webp)
BINNING CAPABILITY
- Missing bumps can be identified.
- High quality imaging providing greater detail of intensities for detecting even floor variations & the height of bumps more accurately.
![](images/defectDetect1.webp)
PARTICLES ON WAFER
- Features capable of detecting the presence of particles, residues, damaged wafers, wafer edges, hard & soft defects with their locations, count and size with high binning accuracy.
- 32 Bit High Dynamic Range Process of Scanning: Provides a wide range of intensities for detecting sub micron particles (0.25 microns) to very large particles (many millimeters) with a single scan for front and back of the wafer.
- Automatic classification of defects through our computer algorithm process of deep learning(A.I).
Application Features
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Follows SEMI Standards for Job Handling
![](images/icons/Recipe management.webp)
Recipe Management
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User and Role Management
Access Control Based on Login
![](images/icons/Defect_Particle Map in Standard Format.webp)
Defect/Particle Map in Standard Format
![](images/icons/Charting Package for Professional Reporting.webp)
Charting Package for Professional Reporting
![](images/icons/3D Viewer with Measurements.webp)
3D Viewer with Measurements
![](images/icons/Die-to-Die Matching.webp)
Die-to-Die Matching
![](images/icons/2D and 3D Analysis.webp)
2D and 3D Analysis
![](images/icons/HDR Imaging.webp)
HDR Imaging
![](images/icons/Edge Inspection.webp)
Edge Inspection
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A.I. Available for Classifying Defects & Tagging defects
![](images/icons/Signature Analysis.webp)
Signature Analysis
![](images/icons/Automatic Notch Detection.webp)
Automatic Notch detection
Brochure
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